Invention Grant
- Patent Title: Polyamide and polyamide composition
- Patent Title (中): 聚酰胺和聚酰胺组合物
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Application No.: US13393604Application Date: 2010-09-07
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Publication No.: US09023975B2Publication Date: 2015-05-05
- Inventor: Yu Nitto , Yasukazu Shikano , Shinji Ieda , Kazunori Terada , Masaaki Aramaki
- Applicant: Yu Nitto , Yasukazu Shikano , Shinji Ieda , Kazunori Terada , Masaaki Aramaki
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Grenblum & Bernstein, P.L.C.
- Priority: JP2009-210853 20090911
- International Application: PCT/JP2010/065284 WO 20100907
- International Announcement: WO2011/030742 WO 20110317
- Main IPC: C08G69/02
- IPC: C08G69/02 ; C08G69/26 ; C08L77/06 ; C08K3/00

Abstract:
[Problem to be Solved]To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating.[Solution]This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60μ equivalents/g.
Public/Granted literature
- US20120165466A1 POLYAMIDE AND POLYAMIDE COMPOSITION Public/Granted day:2012-06-28
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