Invention Grant
- Patent Title: Strain relief for connector and cable interconnection
- Patent Title (中): 应变消除用于连接器和电缆互连
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Application No.: US13633218Application Date: 2012-10-02
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Publication No.: US09024191B2Publication Date: 2015-05-05
- Inventor: Jeffrey D Paynter , Kendrick Van Swearingen , James J Carlock , James P Fleming
- Applicant: Andrew LLC
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Babcock IP, PLLC
- Main IPC: H02G15/02
- IPC: H02G15/02 ; H01R13/58 ; B29C45/14 ; H01R9/05 ; B29L31/34 ; H01R4/02 ; H01R24/56 ; B29L31/00

Abstract:
A strain relief for a coaxial cable and coaxial connector interconnection is provided as an injection moldable polymer material surrounding the interconnection. The injection moldable material fills a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body. Where the outer conductor is corrugated, the polymer material may be provided covering an exposed portion of the corrugations and/or filling portions of a corrugation trough between an outer jacket and the outer diameter of the outer conductor.
Public/Granted literature
- US20130084740A1 Strain Relief for Connector and Cable Interconnection Public/Granted day:2013-04-04
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