Invention Grant
- Patent Title: Multilayer ceramic electronic component and board for mounting the same
- Patent Title (中): 多层陶瓷电子部件和板用于安装
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Application No.: US13950963Application Date: 2013-07-25
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Publication No.: US09024199B2Publication Date: 2015-05-05
- Inventor: Seung Ho Lee , Dae Bok Oh , Jong Han Kim , Su Hwan Cho , Min Gon Lee , Wi Heon Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0050754 20130506
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01G4/01 ; H01G4/30 ; H05K1/18 ; H05K1/03

Abstract:
A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5.
Public/Granted literature
- US20140326493A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME Public/Granted day:2014-11-06
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