Invention Grant
- Patent Title: Multilayer ceramic capacitor and mounting circuit board therefor
- Patent Title (中): 多层陶瓷电容器及其安装电路板
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Application No.: US14061738Application Date: 2013-10-23
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Publication No.: US09024201B2Publication Date: 2015-05-05
- Inventor: Sang Soo Park , Heung Kil Park , Min Cheol Park
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0080241 20130709
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01G2/06 ; H01G4/30 ; H05K1/18 ; H05K3/46 ; H05K1/03

Abstract:
There is provided a multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second external electrodes formed on end surfaces of the ceramic body; first and second terminal electrodes formed on side surfaces of the ceramic body; an active layer including a first internal electrode simultaneously connected to the first terminal electrode and the first external electrode and a second internal electrode simultaneously connected to the second terminal electrode and the second external electrode; upper and lower cover layers formed above and below the active layer; and third and fourth internal electrodes disposed to face each other on a single dielectric layer of the upper or lower cover layer and connected to the first and second terminal electrodes, respectively.
Public/Granted literature
- US20150014035A1 MULTILAYER CERAMIC CAPACITOR AND MOUNTING CIRCUIT BOARD THEREFOR Public/Granted day:2015-01-15
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