Invention Grant
- Patent Title: Aresistive device with flexible substrate and method for manufacturing the same
- Patent Title (中): 具有柔性基板的电阻装置及其制造方法
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Application No.: US13548015Application Date: 2012-07-12
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Publication No.: US09024204B2Publication Date: 2015-05-05
- Inventor: Yen-Ting Lin , Dar-Win Lo , Sung-Chan Yen , Hsing-Kai Cheng
- Applicant: Yen-Ting Lin , Dar-Win Lo , Sung-Chan Yen , Hsing-Kai Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Cyntec Co., Ltd.
- Current Assignee: Cyntec Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: HDLS IPR Serices
- Agent Chun-Ming Shih
- Priority: TW100126756A 20110728
- Main IPC: H05K1/16
- IPC: H05K1/16 ; B32B37/02 ; H01C1/142 ; H01C7/00 ; H01C7/06 ; B32B37/12
Abstract:
A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.
Public/Granted literature
- US20130025915A1 ARESISTIVE DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-01-31
Information query
