Invention Grant
- Patent Title: Solid-state imaging device and method of manufacturing the same, and imaging apparatus
- Patent Title (中): 固态成像装置及其制造方法以及成像装置
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Application No.: US14278548Application Date: 2014-05-15
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Publication No.: US09024249B2Publication Date: 2015-05-05
- Inventor: Atsushi Kawashima , Katsunori Hiramatsu , Yasufumi Miyoshi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2010-169911 20100729
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146
Abstract:
A solid-state imaging device includes: a semiconductor substrate provided with an effective pixel region including a light receiving section that photoelectrically converts incident light; an interconnection layer that is provided at a plane side opposite to the light receiving plane of the semiconductor substrate; a first groove portion that is provided between adjacent light receiving sections and is formed at a predetermined depth from the light receiving plane side of the semiconductor substrate; and an insulating material that is embedded in at least a part of the first groove portion.
Public/Granted literature
- US20140246565A1 SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS Public/Granted day:2014-09-04
Information query
IPC分类:
