Invention Grant
US09024282B2 Techniques and apparatus for high rate hydrogen implantation and co-implantion
有权
用于高速氢气注入和共同注入的技术和设备
- Patent Title: Techniques and apparatus for high rate hydrogen implantation and co-implantion
- Patent Title (中): 用于高速氢气注入和共同注入的技术和设备
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Application No.: US13791141Application Date: 2013-03-08
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Publication No.: US09024282B2Publication Date: 2015-05-05
- Inventor: Svetlana B. Radovanov , Ludovic Godet , Anthony Renau , Xianfeng Lu
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: G21K5/00
- IPC: G21K5/00 ; H01L21/265

Abstract:
An apparatus for hydrogen and helium implantation is disclosed. The apparatus includes a plasma source system to generate helium ions and hydrogen molecular ions comprising H3+ ions. The apparatus further includes a substrate chamber adjacent the plasma source system and in communication with the plasma source system via one or more apertures, an extraction system to extract the hydrogen molecular ions and helium ions from the plasma source system, and an acceleration system to accelerate extracted helium and hydrogen molecular ions to a predetermined energy and direct the extracted helium ions and hydrogen molecular ions to a substrate.
Public/Granted literature
- US20140256121A1 TECHNIQUES AND APPARATUS FOR HIGH RATE HYDROGEN IMPLANTATION AND CO-IMPLANTION Public/Granted day:2014-09-11
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