Invention Grant
- Patent Title: Horizontally oriented and vertically stacked memory cells
- Patent Title (中): 水平方向和垂直堆叠的存储单元
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Application No.: US13759576Application Date: 2013-02-05
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Publication No.: US09024283B2Publication Date: 2015-05-05
- Inventor: Timothy A. Quick , Eugene P. Marsh
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L45/00 ; H01L27/24

Abstract:
Horizontally oriented and vertically stacked memory cells are described herein. One or more method embodiments include forming a vertical stack having a first insulator material, a first memory cell material on the first insulator material, a second insulator material on the first memory cell material, a second memory cell material on the second insulator material, and a third insulator material on the second memory cell material, forming an electrode adjacent a first side of the first memory cell material and a first side of the second memory cell material, and forming an electrode adjacent a second side of the first memory cell material and a second side of the second memory cell material.
Public/Granted literature
- US20130153853A1 HORIZONTALLY ORIENTED AND VERTICALLY STACKED MEMORY CELLS Public/Granted day:2013-06-20
Information query
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