Invention Grant
- Patent Title: Encapsulation layer for electronic devices
- Patent Title (中): 电子设备封装层
-
Application No.: US11189259Application Date: 2005-07-26
-
Publication No.: US09024298B2Publication Date: 2015-05-05
- Inventor: Mihaela Maria Birau , Yiliang Wu , Beng S Ong
- Applicant: Mihaela Maria Birau , Yiliang Wu , Beng S Ong
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Fay Sharpe LLP
- Agent Zosan S. Soong
- Main IPC: H01L51/30
- IPC: H01L51/30 ; H01L51/10 ; H01L51/52 ; H01L51/05
Abstract:
An encapsulation, barrier, or protective layer for electronic devices is disclosed comprising a lac-based material, its synthetic form and variant, or a combination thereof, which protects electronic devices from adverse environmental effects.
Public/Granted literature
- US20070023746A1 Encapsulation layer for electronic devices Public/Granted day:2007-02-01
Information query
IPC分类:
