Invention Grant
US09024341B2 Refractive index tuning of wafer level package LEDs 有权
晶圆级封装LED的折射率调谐

Refractive index tuning of wafer level package LEDs
Abstract:
Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
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