Invention Grant
- Patent Title: Refractive index tuning of wafer level package LEDs
- Patent Title (中): 晶圆级封装LED的折射率调谐
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Application No.: US12912900Application Date: 2010-10-27
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Publication No.: US09024341B2Publication Date: 2015-05-05
- Inventor: Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
- Applicant: Hsiao-Wen Lee , Shang-Yu Tsai , Tien-Ming Lin , Chyi Shyuan Chern , Hsin-Hsien Wu , Fu-Wen Liu , Huai-En Lai , Yu-Sheng Tang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; H01L33/44 ; H01L33/50 ; H01L33/56

Abstract:
Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.
Public/Granted literature
- US20120104435A1 REFRACTIVE INDEX TUNING OF WAFER LEVEL PACKAGE LEDS Public/Granted day:2012-05-03
Information query
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