Invention Grant
- Patent Title: Encapsulating sheet-covered semiconductor element and semiconductor device
- Patent Title (中): 封装片状半导体元件和半导体器件
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Application No.: US14042856Application Date: 2013-10-01
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Publication No.: US09024353B2Publication Date: 2015-05-05
- Inventor: Hiroyuki Katayama , Takashi Kondo , Yuki Ebe , Munehisa Mitani
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-221656 20121003
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/54 ; H01L21/56 ; H01L23/00 ; H01L21/683
Abstract:
An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.
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Information query
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