Invention Grant
US09024364B2 Fin-FET with mechanical stress of the fin perpendicular to the substrate direction
有权
Fin-FET与翅片的机械应力垂直于基板方向
- Patent Title: Fin-FET with mechanical stress of the fin perpendicular to the substrate direction
- Patent Title (中): Fin-FET与翅片的机械应力垂直于基板方向
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Application No.: US13599613Application Date: 2012-08-30
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Publication No.: US09024364B2Publication Date: 2015-05-05
- Inventor: Kimitoshi Okano
- Applicant: Kimitoshi Okano
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-54541 20120312
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L27/088

Abstract:
A semiconductor device in one embodiment includes a semiconductor substrate, a fin disposed on a surface of the semiconductor substrate, an insulator including a gate insulator disposed on a side surface of the fin, and a gate electrode disposed on the insulator that is disposed on side surfaces of the fin and an upper surface of the fin. The device further includes a plurality of epitaxial stripe shaped layers disposed horizontally on the side surface of the fin at different heights, and an interlayer dielectric disposed on the semiconductor substrate to cover the fin and applying a stress to the fin and the epitaxial layers. Any two adjacent epitaxial layers along the fin height direction determine a gap and the gaps between adjacent layers increase or decrease with increasing distance from the substrate.
Public/Granted literature
- US20130234215A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-09-12
Information query
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