A semiconductor device includes a pillar-shaped semiconductor having an impurity concentration of 1017 cm−3 or less, a first insulator that surrounds the pillar-shaped semiconductor, a first metal that surrounds a portion of the first insulator at a first end of the pillar-shaped semiconductor, a second metal that surrounds a portion of the first insulator at the second end of the pillar-shaped semiconductor, a third metal that surrounds a portion of the first insulator in a region sandwiched between the first metal and the second metal, a second insulator formed between the first and third metals, a third insulator formed between the second and third metals, a fourth metal that connects the first metal and the one end, and a fifth metal that connects the second metal and the other end. The third metal has a work function of about 4.2 eV to about 5.0 eV.