Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13034443Application Date: 2011-02-24
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Publication No.: US09024382B2Publication Date: 2015-05-05
- Inventor: Mitsuhiko Kitagawa
- Applicant: Mitsuhiko Kitagawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2010-042235 20100226
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/739 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/417

Abstract:
According to one embodiment, the semiconductor device includes a drift region, a first semiconductor region, a second semiconductor region, a main electrode, first gate electrodes and a second gate electrode. The first gate electrodes and the second gate electrode between a pair of first gate electrodes are provided in the drift region. The first semiconductor region is provided between the first gate electrodes and the second gate electrode. The first semiconductor region has a first side surface opposite to the one of the adjacent ones and a second side surface partially opposite to the second gate electrode. The second semiconductor region is selectively provided on the first semiconductor region. The main electrode has a portion directly adjacent to part of the second side surface and the second semiconductor region.
Public/Granted literature
- US20110210391A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-09-01
Information query
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