Invention Grant
- Patent Title: Integrated electronic components and methods of formation thereof
- Patent Title (中): 集成电子部件及其形成方法
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Application No.: US13733565Application Date: 2013-01-03
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Publication No.: US09024417B2Publication Date: 2015-05-05
- Inventor: Jean-Marc Rollin , David W. Sherrer
- Applicant: Nuvotronics, LLC
- Applicant Address: US VA Radford
- Assignee: Nuvotronics, LLC
- Current Assignee: Nuvotronics, LLC
- Current Assignee Address: US VA Radford
- Agency: Dann Dorfman Herrell & Skillman, PC
- Agent Niels Haun
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/58 ; H01P3/06 ; H01P11/00 ; H05K1/02 ; H05K3/40 ; H05K3/46
Abstract:
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Public/Granted literature
- US20130285218A1 INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF Public/Granted day:2013-10-31
Information query
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