Invention Grant
- Patent Title: Self-aligning conductive bump structure and method of making the same
- Patent Title (中): 自对准导电凸块结构及其制造方法
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Application No.: US13192756Application Date: 2011-07-28
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Publication No.: US09024438B2Publication Date: 2015-05-05
- Inventor: Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
- Applicant: Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/60 ; H01L23/00
Abstract:
A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprises a regular body, and each of a second subset of the conductive bumps comprises a ring-shaped body.
Public/Granted literature
- US20130026620A1 SELF-ALIGNING CONDUCTIVE BUMP STRUCTURE AND METHOD OF MAKING THE SAME Public/Granted day:2013-01-31
Information query
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