Invention Grant
US09024439B2 Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
有权
具有带孔凸起的衬底，具有孔的凸起的半导体芯片，使用其形成的半导体封装及其制造方法
- Patent Title: Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same
- Patent Title (中): 具有带孔凸起的衬底，具有孔的凸起的半导体芯片，使用其形成的半导体封装及其制造方法
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Application No.: US13615859Application Date: 2012-09-14
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Publication No.: US09024439B2Publication Date: 2015-05-05
- Inventor: In Chul Hwang , Il Hwan Cho , Ki Young Kim
- Applicant: In Chul Hwang , Il Hwan Cho , Ki Young Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0039224 20120416
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L21/44 ; H05K1/11 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H05K3/40 ; H05K3/34
Abstract:
Substrates and semiconductor chips are provided. The substrate or the semiconductor chip includes a body and a substantially pillar-shaped bump disposed on a first surface of the body. The pillar-shaped bump has a hole penetrating a portion thereof. Related semiconductor packages are also provided. Further, related methods are provided.
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