Invention Grant
- Patent Title: Bump structure and electronic packaging solder joint structure and fabricating method thereof
- Patent Title (中): 凸块结构和电子封装焊点结构及其制造方法
-
Application No.: US13484289Application Date: 2012-05-31
-
Publication No.: US09024441B2Publication Date: 2015-05-05
- Inventor: Yu-Min Lin , Chau-Jie Zhan , Tao-Chih Chang
- Applicant: Yu-Min Lin , Chau-Jie Zhan , Tao-Chih Chang
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW100150088A 20111230
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00 ; H01L23/498
Abstract:
A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode.
Public/Granted literature
- US20130168851A1 BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND FABRICATING METHOD THEREOF Public/Granted day:2013-07-04
Information query
IPC分类:
