Invention Grant
US09024445B2 Semiconductor device having conductive vias and semiconductor package having semiconductor device
有权
具有导电孔和半导体封装的半导体器件具有半导体器件
- Patent Title: Semiconductor device having conductive vias and semiconductor package having semiconductor device
- Patent Title (中): 具有导电孔和半导体封装的半导体器件具有半导体器件
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Application No.: US13113961Application Date: 2011-05-23
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Publication No.: US09024445B2Publication Date: 2015-05-05
- Inventor: Kuo Hua Chen , Li Wen Tsai
- Applicant: Kuo Hua Chen , Li Wen Tsai
- Applicant Address: TW
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW
- Agency: Morgan Law Offices, PLC
- Priority: TW99140103A 20101119
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/28 ; H01L23/00
Abstract:
The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.
Public/Granted literature
- US20120126420A1 SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR DEVICE Public/Granted day:2012-05-24
Information query
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