Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

Invention Grant

US09024455B2 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device 有权

Title translation: 半导体封装胶粘剂组合物，半导体封装膜状粘合剂，半导体器件和半导体器件的制造方法

Patent Title: Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
Patent Title (中): 半导体封装胶粘剂组合物，半导体封装膜状粘合剂，半导体器件和半导体器件的制造方法
Application No.: US12788110

Application Date: 2010-05-26
Publication No.: US09024455B2

Publication Date: 2015-05-05
Inventor: Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
Applicant: Kazutaka Honda , Tetsuya Enomoto , Yuuki Nakamura
Applicant Address: JP Tokyo
Assignee: Hitachi Chemical Company, Ltd.
Current Assignee: Hitachi Chemical Company, Ltd.
Current Assignee Address: JP Tokyo
Agency: Griffin & Szipl, P.C.
Main IPC: H01L23/29
IPC: H01L23/29 ; C09J163/00 ; H01L21/56

Abstract:

A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

Abstract(Chinese):

一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/28	.封装，例如密封层、涂覆物（H01L23/552优先）
H01L23/29	..按材料特点进行区分的