Invention Grant
- Patent Title: Insert for semiconductor package and testing apparatus with the same
- Patent Title (中): 插入半导体封装和测试仪器
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Application No.: US13587407Application Date: 2012-08-16
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Publication No.: US09024649B2Publication Date: 2015-05-05
- Inventor: Guiheum Choi , Minsu Kang , Teaseog Um , Seunghee Lee
- Applicant: Guiheum Choi , Minsu Kang , Teaseog Um , Seunghee Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2011-0121714 20111121
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; G01R1/04
Abstract:
An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.
Public/Granted literature
- US20130127484A1 INSERT FOR SEMICONDUCTOR PACAKGE AND TESTING APPARATUS WITH THE SAME Public/Granted day:2013-05-23
Information query
