A solid-state imaging device includes: a pixel unit in which pixels each including a photoelectric conversion element are arrayed in a matrix form; a column circuit unit that includes a plurality of column processing circuits which are disposed in correspondence with columns of the pixels in the pixel unit; and an output unit that outputs a signal processed by the column processing circuit to the outside of the solid-state imaging device. The pixel unit is disposed in the 1st substrate. The column circuit unit is disposed in each of at least two or more different substrates of the 1st to nth substrates. The signal processing corresponding to the pixel of each column in the pixel unit is performed in a distributive manner by the column circuit units disposed in at least the two or more different substrates.