Invention Grant
- Patent Title: Laminated suspension flexure with open polyimide base
- Patent Title (中): 具有开放聚酰亚胺基底的层压悬架弯曲
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Application No.: US14065574Application Date: 2013-10-29
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Publication No.: US09025283B1Publication Date: 2015-05-05
- Inventor: Wachira Puttichaem , Adisak Tokaew , Tzong-Shii Pan , Syahril Zainudin , Chaivat Poparisut
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: G11B5/39
- IPC: G11B5/39 ; G11B5/48
Abstract:
A laminated structure includes a metallic layer, a dielectric layer on the metallic layer, wherein the dielectric layer and metallic layer have a slot formed therein, and one or more conductive traces on the dielectric layer opposite the metallic layer, wherein the ends of the one or more traces terminate to form bonding pads extending into the slot. A method of forming a slotted laminated structure includes forming a metallic layer, forming a dielectric layer on the metallic layer, forming a slot in the dielectric layer and metallic layer, and forming one or more electrically conductive traces on the dielectric layer opposite the metallic layer, wherein ends of the one or more traces are formed to terminate with bonding pads extending into the slot.
Information query
IPC分类:
