Invention Grant
- Patent Title: High surface resistivity electrostatic chuck
- Patent Title (中): 高表面电阻率静电卡盘
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Application No.: US13699279Application Date: 2011-05-24
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Publication No.: US09025305B2Publication Date: 2015-05-05
- Inventor: Richard A. Cooke , Dale K. Stone , Lyudmila Stone , Julian Blake , David Suuronen
- Applicant: Richard A. Cooke , Dale K. Stone , Lyudmila Stone , Julian Blake , David Suuronen
- Applicant Address: US MA Eillerica US MA Gloucester
- Assignee: Entegris, Inc.,Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Entegris, Inc.,Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Eillerica US MA Gloucester
- Agency: Hamilton Brook Smith & Reynolds, PC
- International Application: PCT/US2011/037712 WO 20110524
- International Announcement: WO2011/149918 WO 20111201
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H02N13/00 ; B23Q3/152 ; C04B37/00 ; H01L21/683 ; B05D5/12 ; C23F1/00
Abstract:
In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck, the surface layer including a charge control layer comprising a surface resistivity of greater than about 1011 ohms per square.
Public/Granted literature
- US20130070384A1 High Surface Resistivity Electrostatic Chuck Public/Granted day:2013-03-21
Information query
