Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13565309Application Date: 2012-08-02
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Publication No.: US09025307B2Publication Date: 2015-05-05
- Inventor: Jin Hyung Lim , Seok Kyoon Woo , Chung Eun Lee , Doo Young Kim
- Applicant: Jin Hyung Lim , Seok Kyoon Woo , Chung Eun Lee , Doo Young Kim
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0126590 20111130
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G4/008 ; H01G4/012 ; H01G4/12

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; and first and second inner electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body, the first and second inner electrodes being alternately laminated with a difference in printing widths therebetween, wherein a difference ratio between the printing widths of the first and second inner electrodes is 20 to 80%. According to embodiments of the present invention, a multilayer ceramic electronic component having excellent reliability and withstand voltage characteristics may be realized, by reducing the occurrence of cracking through a reduction in the influence of step height while securing high capacitance.
Public/Granted literature
- US20130135787A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-05-30
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