Invention Grant
US09025336B2 Linked semiconductor module unit and electronic circuit-integrated motor device using same
有权
连接半导体模块单元和使用其的电子电路集成电机器件
- Patent Title: Linked semiconductor module unit and electronic circuit-integrated motor device using same
- Patent Title (中): 连接半导体模块单元和使用其的电子电路集成电机器件
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Application No.: US14094217Application Date: 2013-12-02
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Publication No.: US09025336B2Publication Date: 2015-05-05
- Inventor: Hideki Minato , Hideki Kabune , Atsushi Furumoto
- Applicant: Denso Corporation
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2009-149647 20090624; JP2010-17450 20100128
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H02K11/00 ; H01L21/56 ; H01L23/495 ; H01L25/07 ; H02K3/52 ; H02K11/02 ; H02K9/22 ; H01L23/31 ; H01L23/00
Abstract:
A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
Public/Granted literature
- US20140084722A1 LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME Public/Granted day:2014-03-27
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