A fixing fitting includes a solder connecting plate part soldered and fixed to a surface of the circuit board by using a cream solder and a parts fixing part which is fixed to a connector to be mounted on the circuit board. On a solder connected surface of a lower surface of the solder connecting plate part, V grooves are formed which suck up the cream solder applied on the surface of the circuit board in accordance with a capillary phenomenon. Further, a plurality of communicating holes which communicate with tapered parts of the V grooves and can suck up the cream solder by the capillary phenomenon are bored from an upper surface to the lower surface of the solder connecting plate part with prescribed spaces provided between them in the direction where the V grooves extend.