Invention Grant
US09025356B2 Fly-over conductor segments in integrated circuits with successive load devices along a signal path
有权
集成电路中的飞越导体段,沿着信号路径连续的负载装置
- Patent Title: Fly-over conductor segments in integrated circuits with successive load devices along a signal path
- Patent Title (中): 集成电路中的飞越导体段,沿着信号路径连续的负载装置
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Application No.: US13221081Application Date: 2011-08-30
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Publication No.: US09025356B2Publication Date: 2015-05-05
- Inventor: Hsiao-Wen Lu , Wei-Jer Hsieh , Chiting Cheng , Chung-Cheng Chou , Jonathan Tsung-Yung Chang
- Applicant: Hsiao-Wen Lu , Wei-Jer Hsieh , Chiting Cheng , Chung-Cheng Chou , Jonathan Tsung-Yung Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C7/10 ; G11C11/00 ; G11C11/413

Abstract:
The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.
Public/Granted literature
- US20130051128A1 FLY-OVER CONDUCTOR SEGMENTS IN INTEGRATED CIRCUITS WITH SUCCESSIVE LOAD DEVICES ALONG A SIGNAL PATH Public/Granted day:2013-02-28
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