Invention Grant
- Patent Title: High-output microspeaker
- Patent Title (中): 高输出微型扬声器
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Application No.: US14116197Application Date: 2012-05-10
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Publication No.: US09025808B2Publication Date: 2015-05-05
- Inventor: Joong Hak Kwon , Cheon Myeong Kim , Ji Hoon Kim , Kyu Dong Choi
- Applicant: Joong Hak Kwon , Cheon Myeong Kim , Ji Hoon Kim , Kyu Dong Choi
- Applicant Address: KR Busan
- Assignee: Em-Tech. Co., Ltd.
- Current Assignee: Em-Tech. Co., Ltd.
- Current Assignee Address: KR Busan
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: KR10-2011-0045070 20110513
- International Application: PCT/KR2012/003653 WO 20120510
- International Announcement: WO2012/157888 WO 20121122
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R9/04

Abstract:
The present invention relates to a high-output microspeaker, and more particularly, to a high-output microspeaker which includes a damper for preventing lateral vibrations of a diaphragm. The present invention discloses a high-output microspeaker, comprising: a frame; a protector; a yoke assembly coupled to the frame and including a magnet; a diaphragm provided in the frame and producing vibration; a voice coil coupled to the diaphragm and vibrating the diaphragm; a terminal provided on one side of the frame and providing an electrical connection between the lead wire of the voice coil and an external terminal; and a damper formed of an FPCB that includes an inner portion to which a center diaphragm, a side diaphragm and the voice coil are attached, an outer portion to which the side diaphragm is attached and which is in contact with the frame and the protector, a support portion functioning to connect the voice coil, the outer portion and the inner portion and including a land portion to which the lead-in wire of the coil is soldered or welded, and a connecting portion extending outward from the outer portion and providing an electrical connection between the terminal provided on the frame and the outer portion.
Public/Granted literature
- US20140169593A1 HIGH-OUTPUT MICROSPEAKER Public/Granted day:2014-06-19
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