Invention Grant
- Patent Title: Substrate inspection apparatus and method for operating the same
- Patent Title (中): 基板检查装置及其操作方法
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Application No.: US13482270Application Date: 2012-05-29
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Publication No.: US09025852B2Publication Date: 2015-05-05
- Inventor: Kazuya Hisano , Hiroshi Tomita , Norihisa Koga , Tadashi Nishiyama , Makoto Hayakawa
- Applicant: Kazuya Hisano , Hiroshi Tomita , Norihisa Koga , Tadashi Nishiyama , Makoto Hayakawa
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2011-120917 20110530
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N21/956 ; G01N21/88 ; G01N21/93 ; G01N21/95 ; G06T7/00

Abstract:
In one embodiment, a substrate inspection apparatus performs, in its maintenance mode, operations including: guiding a light emitted from an illuminating unit to an imaging device via a light-guiding member disposed in a casing; judging whether or not a level of a brightness signal obtained by the imaging device falls within a predetermined allowable range when a light emitted from the illuminating unit falls on the imaging device via the light-guiding member; and alarming, if it is judged that the value of the brightness signal is out of the predetermined allowable range, that replacement of the illuminating unit is required.
Public/Granted literature
- US20120307045A1 SUBSTRATE INSPECTION APPARATUS AND METHOD FOR OPERATING THE SAME Public/Granted day:2012-12-06
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