Invention Grant
- Patent Title: Multi-systems integrated modulation module and communication device
- Patent Title (中): 多系统集成调制模块和通信设备
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Application No.: US14068096Application Date: 2013-10-31
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Publication No.: US09026071B2Publication Date: 2015-05-05
- Inventor: Peng-Sen Chen
- Applicant: ISSC Technologies Corp.
- Applicant Address: TW Hsinchu
- Assignee: ISSC Technologies Corp.
- Current Assignee: ISSC Technologies Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Li&Cai Intellectual Property (USA) Office
- Priority: TW102127755A 20130802
- Main IPC: H04B1/10
- IPC: H04B1/10 ; H04L27/00 ; H04W88/06

Abstract:
The present disclosure illustrates a multi-systems integrated modulation module. The modulation module includes a first modulation circuit and a second modulation circuit. The first modulation circuit includes a high frequency oscillator and high frequency mixers. The second modulation circuit includes a low frequency oscillator and low frequency mixers. The second modulation circuit couples to the first modulation circuit. The high frequency mixers couple to the high frequency oscillator and the low frequency mixers couple to the low frequency oscillator. The high frequency mixers and the low frequency mixers provide high frequency signals and low frequency signals separately. The frequency mixers mix radio frequency signals with the high frequency signals or low frequency signals. The modulation module forms a first signal path by the first modulation circuit, and forms a second signal path by the first modulation circuit and the second modulation circuit.
Public/Granted literature
- US20150036725A1 MULTI-SYSTEMS INTEGRATED MODULATION MODULE AND COMMUNICATION DEVICE Public/Granted day:2015-02-05
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