Invention Grant
- Patent Title: Field serviceable IT system
- Patent Title (中): 现场可维修的IT系统
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Application No.: US13436885Application Date: 2012-03-31
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Publication No.: US09026708B1Publication Date: 2015-05-05
- Inventor: Joseph E. Fenton , Adrianus Djohan , Jason A. Harland
- Applicant: Joseph E. Fenton , Adrianus Djohan , Jason A. Harland
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agency: Holland & Knight LLP
- Agent Brian J. Colandreo; Mark H. Whittenberger
- Main IPC: H05K7/10
- IPC: H05K7/10 ; G06F1/16
Abstract:
A field serviceable IT system includes an IT enclosure. A first connector assembly is positioned within the IT enclosure. At least one I/O module is releasably coupled to the first connector assembly and positioned within the IT enclosure. A disk subsystem is releasably coupled to the at least one I/O module and positioned within the IT enclosure. At least one disk drive assembly is releasably coupled to the disk subsystem and positioned within the IT enclosure. A system board is releasably coupled to the first connector assembly and positioned within the IT enclosure. The system board is configured to be removable from the IT enclosure without first removing the at least one I/O module or the at least one disk drive assembly from the IT enclosure.
Information query
