Invention Grant
- Patent Title: Sound-absorbing member lamination structure
- Patent Title (中): 吸声构件层叠结构
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Application No.: US14041586Application Date: 2013-09-30
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Publication No.: US09027705B2Publication Date: 2015-05-12
- Inventor: Hidekazu Furusawa , Yasuya Kubota
- Applicant: HOUSE 119 Inc.
- Applicant Address: JP Fukuoka
- Assignee: Aural Sonic Inc.
- Current Assignee: Aural Sonic Inc.
- Current Assignee Address: JP Fukuoka
- Agency: Dingman, McInnes & McLane, LLP
- Main IPC: E04B1/82
- IPC: E04B1/82 ; E04B1/84 ; G10K11/168 ; E04B1/74

Abstract:
There is provided a sound absorbing member lamination structure in which the functions by the sound field adjustment can effectively be achieved by preventing the sound reflection against an intension of design in a boundary between the sound absorbing member and the other layer, when the sound absorbing member and the other layer are laminated into a united body. When the sound absorbing member and the other layer are placed in a stacked state, they are bonded with the use of a pressure-sensitive adhesive, so that the sound absorbing member and the other layer are combined together, with the pressure-sensitive adhesive kept uncured in a stacked state of the sound absorbing member and the other layer. Thus, such an uncured pressure-sensitive adhesive does not become a reflection portion of a sound. It is therefore possible to cause the sound to pass through appropriately the boundary between the respective layers.
Public/Granted literature
- US20140097038A1 Sound-Absorbing Member Lamination Structure Public/Granted day:2014-04-10
Information query
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