Invention Grant
- Patent Title: Vibration damping mechanism
- Patent Title (中): 振动阻尼机构
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Application No.: US13817843Application Date: 2011-07-14
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Publication No.: US09027720B2Publication Date: 2015-05-12
- Inventor: Tatsuya Ogata
- Applicant: Tatsuya Ogata
- Applicant Address: JP Higashiosaka-shi, Osaka
- Assignee: Daishowa Seiki Kabushiki Kaisha
- Current Assignee: Daishowa Seiki Kabushiki Kaisha
- Current Assignee Address: JP Higashiosaka-shi, Osaka
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2010-202936 20100910
- International Application: PCT/JP2011/066116 WO 20110714
- International Announcement: WO2012/032852 WO 20120315
- Main IPC: F16F7/08
- IPC: F16F7/08 ; B23B27/00 ; F16F15/14 ; F16F15/32 ; B23B29/02

Abstract:
A vibration damping mechanism allows increase of an absorption amount of vibration energy, with less possibilities of increase in the manufacture cost of a vibration damping weight and of reduction in the strength of a shaft section. Within a cylindrical hollow portion formed inside the shaft section, there are accommodated a plurality of weight members divided from each other along the circumferential direction about the axis of the hollow portion. An urging member is provided for urging the weight members toward the axis such that dividing faces of adjacent weight members are brought into surface contact with each other.
Public/Granted literature
- US20130206525A1 VIBRATION DAMPING MECHANISM Public/Granted day:2013-08-15
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