Invention Grant
- Patent Title: Device for thermal adaption
- Patent Title (中): 热适应装置
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Application No.: US13145099Application Date: 2010-02-11
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Publication No.: US09028137B2Publication Date: 2015-05-12
- Inventor: Peder Sjölund , Jussi Myllyluoma
- Applicant: Peder Sjölund , Jussi Myllyluoma
- Applicant Address: SE Örnsköldsvik
- Assignee: BAE Systems Hägglunds Aktiebolag
- Current Assignee: BAE Systems Hägglunds Aktiebolag
- Current Assignee Address: SE Örnsköldsvik
- Agency: Morrison & Foerster LLP
- Priority: SE0950071 20090211
- International Application: PCT/SE2010/050162 WO 20100211
- International Announcement: WO2010/093323 WO 20100819
- Main IPC: G01K3/06
- IPC: G01K3/06 ; G01K17/08 ; B60N2/56 ; F41H3/00

Abstract:
The invention relates to a device for thermal adaptation, comprising at least one surface element arranged to assume a determined thermal distribution, said surface element comprising a first heat conducting layer, a second heat conducting layer, said first and second heat conducting layers being mutually thermally isolated by means of an intermediate insulation layer, wherein at least one thermoelectric element is arranged to generate a predetermined temperature gradient to a portion of said first layer. The invention also relates to an object such as a craft.
Public/Granted literature
- US20120031452A1 DEVICE FOR THERMAL ADAPTION Public/Granted day:2012-02-09
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