Invention Grant
- Patent Title: Electric wire connection structure of connector terminal and method for fabricating the same
- Patent Title (中): 连接器端子的电线连接结构及其制造方法
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Application No.: US13884550Application Date: 2011-12-12
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Publication No.: US09028283B2Publication Date: 2015-05-12
- Inventor: Kei Sato , Shinji Kodama
- Applicant: Kei Sato , Shinji Kodama
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2010-277268 20101213
- International Application: PCT/JP2011/078705 WO 20111212
- International Announcement: WO2012/081552 WO 20120621
- Main IPC: H01R43/24
- IPC: H01R43/24 ; H01R43/048 ; H01R4/18 ; H01R4/70 ; H01R43/00

Abstract:
It is an objective to enhance sealing performance of a resin mold without subjecting a connector housing to special work. In an electric wire connection structure of a connector terminal in which an end of an electric wire (W) is connected to a rear portion of a connector terminal (10) and in which the electric wire connection is sealed of a resin mold (20), a step (d) that makes an underside (13b) of a rearmost end of the connector terminal (10) higher than an underside of an area ahead of the rearmost end is provided between the underside (13b) of the rearmost end and the underside (12b) ahead of the rearmost end, thereby assuring space (22) that enables filling of a resin which makes up a resin mold (20).
Public/Granted literature
- US20130252481A1 ELECTRIC WIRE CONNECTION STRUCTURE OF CONNECTOR TERMINAL AND METHOD FOR FABRICATING THE SAME Public/Granted day:2013-09-26
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