Invention Grant
- Patent Title: Grinding tool adapted to collect grinding particles
- Patent Title (中): 研磨工具适用于收集研磨颗粒
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Application No.: US13524204Application Date: 2012-06-15
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Publication No.: US09028300B2Publication Date: 2015-05-12
- Inventor: Jang-Hyuk Ahn , Jong-Kook Yeom
- Applicant: Jang-Hyuk Ahn , Jong-Kook Yeom
- Applicant Address: KR Gyunggi-Do
- Assignee: Ehwa Diamond Industrial Co., Ltd.
- Current Assignee: Ehwa Diamond Industrial Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: KR10-2011-0087818 20110831; KR10-2011-0109451 20111025
- Main IPC: B24B55/06
- IPC: B24B55/06 ; B24D7/06 ; B24D7/10

Abstract:
Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.
Public/Granted literature
- US20130052922A1 GRINDING TOOL Public/Granted day:2013-02-28
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