Invention Grant
- Patent Title: Polishing pad for eddy current end-point detection
- Patent Title (中): 用于涡流端点检测的抛光垫
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Application No.: US14099655Application Date: 2013-12-06
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Publication No.: US09028302B2Publication Date: 2015-05-12
- Inventor: William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
- Applicant: William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
- Applicant Address: US OR Hillsboro
- Assignee: NexPlanar Corporation
- Current Assignee: NexPlanar Corporation
- Current Assignee Address: US OR Hillsboro
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B24D11/00 ; B24B37/013 ; B24B37/20 ; B24B49/10
Abstract:
Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
Public/Granted literature
- US20140102010A1 Polishing Pad for Eddy Current End-Point Detection Public/Granted day:2014-04-17
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