Invention Grant
- Patent Title: Styrene resin composition, and molded article thereof
- Patent Title (中): 苯乙烯树脂组合物及其成型体
-
Application No.: US13877707Application Date: 2011-10-06
-
Publication No.: US09028938B2Publication Date: 2015-05-12
- Inventor: Junpei Fujiwara , Masatoshi Kawata
- Applicant: Junpei Fujiwara , Masatoshi Kawata
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-227462 20101007; JP2010-286980 20101224
- International Application: PCT/JP2011/073112 WO 20111006
- International Announcement: WO2012/046809 WO 20120412
- Main IPC: B65D85/00
- IPC: B65D85/00 ; C08L53/00 ; C08L25/06 ; B65D73/02 ; C08L53/02 ; C08J5/18
Abstract:
An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.
Public/Granted literature
- US20130209742A1 STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF Public/Granted day:2013-08-15
Information query
IPC分类:
