Invention Grant
US09028949B2 Substrate for printed wiring and resin composition used therefor
有权
用于印刷线路的基板和用于其的树脂组合物
- Patent Title: Substrate for printed wiring and resin composition used therefor
- Patent Title (中): 用于印刷线路的基板和用于其的树脂组合物
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Application No.: US13503023Application Date: 2010-10-20
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Publication No.: US09028949B2Publication Date: 2015-05-12
- Inventor: Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
- Applicant: Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-241902 20091020; JP2010-149830 20100630
- International Application: PCT/JP2010/068433 WO 20101020
- International Announcement: WO2011/049104 WO 20110428
- Main IPC: C08G65/40
- IPC: C08G65/40 ; H05K1/03 ; C08G75/23
Abstract:
There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.
Public/Granted literature
- US20120199383A1 SUBSTRATE FOR PRINTED WIRING AND RESIN COMPOSITION USED THEREFOR Public/Granted day:2012-08-09
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