The molding packaging material 1 according to the present invention includes a heat resistant resin layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between the heat resistant resin layer and the thermoplastic resin layer, and a black ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin layer 2. The black ink layer 10 contains carbon black, diamine, polyol, and hardening agent. The black ink layer does not partially crack and detach even when the molding packaging material according to the present invention is used in a somewhat harsh environment such as a hot and humid environment and/or at the time of molding or sealing.