Invention Grant
US09029172B2 On-chip poly-to-contact process monitoring and reliability evaluation system and method of use
有权
片上多点接触过程监控与可靠性评估系统及使用方法
- Patent Title: On-chip poly-to-contact process monitoring and reliability evaluation system and method of use
- Patent Title (中): 片上多点接触过程监控与可靠性评估系统及使用方法
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Application No.: US13354547Application Date: 2012-01-20
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Publication No.: US09029172B2Publication Date: 2015-05-12
- Inventor: Fen Chen , Roger A. Dufresne , Timothy D. Sullivan , Yanfeng Wang
- Applicant: Fen Chen , Roger A. Dufresne , Timothy D. Sullivan , Yanfeng Wang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Michael Lestrange
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66
Abstract:
An on-chip poly-to-contact process monitoring and reliability evaluation system and method of use are provided. A method includes determining a breakdown electrical field of each of one or more shallow trench isolation (STI) measurement structures corresponding to respective one or more original semiconductor structures. The method further includes determining a breakdown voltage of each of one or more substrate measurement structures corresponding to the respective one or more original semiconductor structures. The method further includes determining a space between a gate and a contact of each of the one or more original semiconductor structures based on the determined breakdown electrical field and the determined breakdown voltage.
Public/Granted literature
- US20130191047A1 ON-CHIP POLY-TO-CONTACT PROCESS MONITORING AND RELIABILITY EVALUATION SYSTEM AND METHOD OF USE Public/Granted day:2013-07-25
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