Invention Grant
US09029220B2 Method of manufacturing a semiconductor device with self-aligned contact plugs and semiconductor device
有权
制造具有自对准接触插塞和半导体器件的半导体器件的方法
- Patent Title: Method of manufacturing a semiconductor device with self-aligned contact plugs and semiconductor device
- Patent Title (中): 制造具有自对准接触插塞和半导体器件的半导体器件的方法
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Application No.: US13920179Application Date: 2013-06-18
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Publication No.: US09029220B2Publication Date: 2015-05-12
- Inventor: Martin Poelzl
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/78

Abstract:
Semiconductor oxide pillars are selectively grown on semiconductor mesas between precursor structures that extend from a main surface into a semiconductor substrate. Spaces between the semiconductor oxide pillars are filled with one or more auxiliary materials to form alignment plugs in a vertical projection of the precursor structures. The semiconductor oxide pillars are removed selectively against the alignment plugs. Contact spacers are provided along sidewalls of the alignment plugs. Between opposing ones of the contact spacers contact plugs are provided directly adjoining the semiconductor mesas. The contact plugs are self-aligned to the semiconductor mesas and allow a further reduction of the lateral dimensions of the semiconductor mesas without recessing the semiconductor mesas.
Public/Granted literature
- US20140367773A1 Method of Manufacturing a Semiconductor Device with Self-Aligned Contact Plugs and Semiconductor Device Public/Granted day:2014-12-18
Information query
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