Invention Grant
- Patent Title: Three-dimensional quantum well transistor and fabrication method
- Patent Title (中): 三维量子阱晶体管及其制作方法
-
Application No.: US14144623Application Date: 2013-12-31
-
Publication No.: US09029222B2Publication Date: 2015-05-12
- Inventor: De Yuan Xiao
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201310024090 20130122
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L29/778 ; H01L29/51 ; H01L29/20

Abstract:
Three dimensional quantum well transistors and fabrication methods are provided. A quantum well layer, a barrier layer, and a gate structure can be sequentially formed on an insulating surface of a fin part. The gate structure can be formed over the barrier layer and across the fin part. The QW layer and the barrier layer can form a hetero-junction of the transistor. A recess can be formed in the fin part on both sides of the gate structure to suspend a sidewall spacer. A source and a drain can be formed by growing an epitaxial material in the recess and the sidewall spacer formed on both sidewalls of the gate electrode can be positioned on surface of the source and the drain.
Public/Granted literature
- US20140203243A1 THREE-DIMENSIONAL QUANTUM WELL TRANSISTOR AND FABRICATION METHOD Public/Granted day:2014-07-24
Information query
IPC分类: