Invention Grant
- Patent Title: High-K layers, transistors, and fabrication method
- Patent Title (中): 高K层,晶体管和制造方法
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Application No.: US13736093Application Date: 2013-01-08
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Publication No.: US09029224B2Publication Date: 2015-05-12
- Inventor: Yong Chen , Yonggen He
- Applicant: Semiconductor Manufacturing International Corp.
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International Corp.
- Current Assignee: Semiconductor Manufacturing International Corp.
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201210287384 20120813
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/31 ; H01L21/469 ; H01L21/02 ; H01L29/78 ; H01L29/66 ; H01L21/314 ; C23C16/40 ; C23C16/455 ; H01L21/28 ; H01L29/51 ; H01L29/49

Abstract:
A method is provided for fabricating a High-K layer. The method includes providing a substrate, applying a first precursor gas on the substrate such that the substrate absorbs first precursor gas molecules in a chemical absorption process, and removing the unabsorbed first precursor gas using a first inert gas. The method also includes applying a second precursor gas on the substrate, and forming a first thin film on the substrate as a reaction product of the second precursor gas and the absorbed first precursor gas molecules. Further, the method includes removing unreacted second precursor gas and byproducts using a second inert gas, and forming a high-K layer on the substrate by forming a plurality of the first thin films layer-by-layer.
Public/Granted literature
- US20140042559A1 HIGH-K LAYERS, TRANSISTORS, AND FABRICATION METHOD Public/Granted day:2014-02-13
Information query
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