Invention Grant
- Patent Title: Methods of forming epitaxial structures
- Patent Title (中): 形成外延结构的方法
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Application No.: US13954659Application Date: 2013-07-30
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Publication No.: US09029246B2Publication Date: 2015-05-12
- Inventor: Meng-Ku Chen , Hung-Ta Lin , Pang-Yen Tsai , Huicheng Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36 ; H01L29/06 ; H01L21/762

Abstract:
An embodiment is a method. A first III-V compound semiconductor is epitaxially grown in a trench on a substrate, and the epitaxial growth is performed in a chamber. The first III-V compound semiconductor has a first surface comprising a facet. After the epitaxial growth, the first surface of the first III-V compound semiconductor is etched to form an altered surface of the first III-V compound semiconductor. Etching the first surface is performed in the chamber in situ. A second III-V compound semiconductor is epitaxially grown on the altered surface of the first III-V compound semiconductor. The epitaxial growth of the first III-V compound semiconductor may be performed in a MOCVD chamber, and the etch may use an HCl gas. Structures resulting from methods are also disclosed.
Public/Granted literature
- US20150035113A1 Epitaxial Structures and Methods of Forming the Same Public/Granted day:2015-02-05
Information query
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