Invention Grant
- Patent Title: Metal complexes with bipodal ligands
- Patent Title (中): 具有双配体配体的金属络合物
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Application No.: US10578039Application Date: 2004-10-21
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Publication No.: US09029539B2Publication Date: 2015-05-12
- Inventor: Philipp Stössel , Anja Gerhard
- Applicant: Philipp Stössel , Anja Gerhard
- Applicant Address: DE
- Assignee: Merck Patent GmbH
- Current Assignee: Merck Patent GmbH
- Current Assignee Address: DE
- Agency: Drinker Biddle & Reath LLP
- Priority: DE10350722 20031030
- International Application: PCT/EP2004/011890 WO 20041021
- International Announcement: WO2005/042550 WO 20050512
- Main IPC: C07F15/00
- IPC: C07F15/00 ; H01L51/50 ; H01L51/00 ; C07D213/26 ; C07D213/30 ; C07F9/58

Abstract:
The invention relates to a compound of the Structure 1 wherein Structure 1 contains a metal Met, coordinated to a tetradentate chelating ligand Lig of Structure 2 where V is a bridging unit which contains 1 to 40 atoms from the third, fourth, fifth and/or sixth main group and connects the two ligand moieties L1 and L2, which may be identical or different on each occurrence, covalently to one another, and where the two ligand moieties L1 and L2 satisfy Structure 3 where Cy1 and Cy2, identically or differently on each occurrence, correspond to a substituted or unsubstituted, saturated, unsaturated or aromatic homo- or heterocyclic ring, which is in each case bonded ionically, covalently or coordinatively to the metal via a ring atom or via an atom bonded exocyclically to the homo- or heterocyclic ring; and where L3, identically or differently on each occurrence, is a mono- or bidentate, neutral or monoanionic ligand, and where a is 0, 1 or 2. The present invention describes novel metal complexes with bipolar ligands. Compounds of this type can be employed as functional materials in a number of different applications which can be ascribed to the electronics industry in the broadest sense.
Public/Granted literature
- US20070082284A1 Metal complexes with bipodal ligands Public/Granted day:2007-04-12
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