Invention Grant
- Patent Title: Connection assembly for a sensor assembly and sensor assembly
- Patent Title (中): 传感器组件和传感器组件的连接组件
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Application No.: US13392675Application Date: 2010-07-05
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Publication No.: US09029702B2Publication Date: 2015-05-12
- Inventor: Ronald Steinbrink , Sven Kluge , Stefan Ortmann , Steffen Schulze , Daniel Matthie , Jens Liebetrau , Frank Weishaeutel , Jan Beyersdorfer
- Applicant: Ronald Steinbrink , Sven Kluge , Stefan Ortmann , Steffen Schulze , Daniel Matthie , Jens Liebetrau , Frank Weishaeutel , Jan Beyersdorfer
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot, Moore & Beck LLP
- Priority: DE102009028963 20090828
- International Application: PCT/EP2010/059555 WO 20100705
- International Announcement: WO2011/023439 WO 20110303
- Main IPC: H02G15/02
- IPC: H02G15/02 ; G01D11/30 ; G01D11/24 ; G01P1/02

Abstract:
The disclosure relates to a connection assembly for a sensor assembly having a connection element which is electrically and mechanically connected to one end of at least one wire of a connection cable in a first contacting region and can be electrically and mechanically connected to a sensor element in a second contacting region, wherein the connection element is at least partially enclosed by a plastic overmold which has a window-shaped recess in a transition region between the first contacting region and the second contacting region which is sealed in the injection molding die during the injection process of the plastic overmold and a corresponding sensor assembly. According to the disclosure, a positioning opening is arranged in the transition region such that the connection element can be positioned in the injection molding die and the transition region surrounding the positioning opening is sealed flat in the injection molding die to create the window-shaped recess.
Public/Granted literature
- US20120198933A1 Connection Assembly for a Sensor Assembly and Sensor Assembly Public/Granted day:2012-08-09
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