Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
-
Application No.: US13086449Application Date: 2011-04-14
-
Publication No.: US09029708B2Publication Date: 2015-05-12
- Inventor: Tetsuya Oosawa , Mitsuru Honjo , Daisuke Yamauchi
- Applicant: Tetsuya Oosawa , Mitsuru Honjo , Daisuke Yamauchi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2010-101352 20100426
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/05 ; H05K1/02

Abstract:
A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.
Public/Granted literature
- US20110259632A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-10-27
Information query