Invention Grant
US09029708B2 Printed circuit board and method of manufacturing the same 有权
印刷电路板及其制造方法

Printed circuit board and method of manufacturing the same
Abstract:
A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.
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