Provided is a transparent flexible printed wiring board which is excellent in flexibility, heat resistance and adhesion between a transparent film and a transparent conductive film.A transparent polyimide film, whose dimension change rate in association with a baking process is not larger than ±0.2%, is prepared. ITO ink containing ITO fine particles and a binder is printed in the form of a predetermined pattern on the transparent polyimide film by an ink-jet method. The ITO ink is then baked at 230 to 300° C., thereby forming a transparent conductive film with a binder ratio of 5 to 10 wt %.